You know on your first read of your comments I did not actually grok it and was still confused but I think now I get it. Its the localization that helps it more than having a generally thermally conductive material across the whole thing. That is if I did indeed get what you are saying.
Yep, at least that’s how I understood it. They are able to change the thermal conductivity of specific parts of the chip which then allows more heat to be redirected into those specific areas than what they experience in conventional chips.
The actual processor cores generally are the largest heat source, where as auxiliary components are relatively cooler. This technology theoretically will heat those cooler areas by transferring heat away from the cores, which in turn cools the cores down.
The current research was done at the transistor level though, which means there is a significant amount of time and work required before complete chips will actually be able to implement this cooling method.
You know on your first read of your comments I did not actually grok it and was still confused but I think now I get it. Its the localization that helps it more than having a generally thermally conductive material across the whole thing. That is if I did indeed get what you are saying.
Yep, at least that’s how I understood it. They are able to change the thermal conductivity of specific parts of the chip which then allows more heat to be redirected into those specific areas than what they experience in conventional chips.
The actual processor cores generally are the largest heat source, where as auxiliary components are relatively cooler. This technology theoretically will heat those cooler areas by transferring heat away from the cores, which in turn cools the cores down.
The current research was done at the transistor level though, which means there is a significant amount of time and work required before complete chips will actually be able to implement this cooling method.